2nd Optical inspection equipment is used for wafer appearance inspection before or after sawing; it adopts multiple objective microscope modules, high-speed camera with fast flying scan to collect images, and supports a variety of intelligent algorithms; it supports black and white color dual vision configuration, which can realize black and white/color, high and low magnification switching inspection; the equipment supports SECS/GEM communication to realize equipment monitoring and data upload. Achievable the surface inspection in both bright and dark fields by dual illumination methods. Support standard and customized mapping formats, supports online and offline high magnification recheck functions. The system includes AI-driven features for improved performance and automation.
3rd Optical inspection equipment is used for after die attach & wire bond process, available for 2D & 3D scan; it adopts high resolutions optical lens, high-speed camera with fast flying shot to collect images, and supports a variety of intelligent algorithms; it supports mono and color vision configuration, the equipment supports SECS/GEM communication to realize equipment monitoring and data upload. Achievable the surface inspection in both bright and dark fields by dual illumination methods. Support standard and customized mapping formats, supports online and offline high magnification recheck functions. The system includes AI-driven features for improved performance and automation.
The PNP handler adopts multiple groups of tray loading and unloading device, picking and placing IC by combined type gripper, then the test gripper will pick up IC and move it to the circuit test socket to match with the IC contact, test the logic circuit of IC and store the test results, which can realize the ambient/high temperature or cold temperature electric test of IC, and automatically sort according to the test results.
Technical parameters are leading domestically and can replace imported equipment, superior performance, precise chip retrieval and placement, high yield, high first test yield, integrated visual system, capable of low-temperature testing.
