JAF Die / Chip Bonder - Advance Precision Automation Industry Sdn Bhd

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JAF Die / Chip Bonder

A trusted manufacturer of high-end semiconductor packaging equipment, JAF provides innovative bonding solutions engineered to improve production efficiency, precision, and long-term reliability.

JAF-300Pro

8" Soft Solder Die Bonder

Features

8 heating zones & 10 mixed gas zones, each independently adjustable.
Dual solder paste writing modes, dot/writing + spanker mode switchable.
Bond head rotation: ±180°
Pre-bond & Post-bond functions
Supports StripMap
Optional PBI vision inspection system

Specification

Applications	TO series / PDFN series / TOLL series / IPM series, etc.
Die size	0.8mm × 0.8mm – 12mm × 12mm
Die placement	±50μm @3σ
Rotation	±2° @3σ
Wafer size	6″, 8″
UPH	3000 ~ 7000
Void Rate	Single <2%, total <5%
BLT	25μm–75μm
Die tilt	<35μm
Lead frame size	L: 170–300mm W: 25–70mm (90mm Optional) T: 0.3–2.8mm
Dimensions	2048mm × 1300mm × 1650mm

JAF-3012Pro

12" Soft Solder Die Bonder

Features

Dual solder paste writing modes, dot/writing + spanker mode switchable.
Pre-solder area inspection.
Arbitrary editing of writing patterns.
Automatic wafer loading/unloading.
Bond force: 50~350g (programmable).
5MP color camera with digital zoom vision.
Pre-bond & Post-bond functions.

Specification

Applications	TO / PDFN / TOLL / IPM series, etc.
Die size	0.8mm × 0.8mm – 12mm × 12mm
Die placement	±50μm @3σ
Rotation	±2° @3σ
Wafer size	6″, 8″, 12″
UPH	3000 ~ 7000
Void Rate	Single <2%, total <5%
BLT	25μm–75μm
Die tilt	<35μm
Lead frame size	L: 170–300mm W: 25–90mm (100mm optional) T: 0.3–2.8mm
Dimensions	2230mm × 1420mm × 1650mm

JAF-3012MS

12" Dual Die Soft Solder Die Bonder

Features

10 heating zones
Double wafer table compatible with 16″, 8″, 12″
Double solder paste writing modes
Double dot/writing + double spanker optional
Support double wafer cassette loading and unloading
Bond force: 50~350g (programmable)
Double transport platform with visual automatic compensation
Dust self-cleaning and image foreign object detection functions
Pre bond and Post bond functions

Specification

Applications	TO / PDFN / TOLL / IPM series
Die Size	0.8mm × 0.8mm – 12mm × 12mm
Die placement	±50μm @3σ
Rotation	±2° @3σ
Wafer size	6″, 8″, 12″
UPH	2000–4000 (depending on product)
Void Rate	Single <2%, total <5%
BLT	25μm–75μm
Die tilt	<35μm
Lead frame size	L: 170–300mm W: 25–90mm T: 0.3–2.8mm
Dimensions	2830mm × 1465mm × 1565mm

JAF-760SE

Epoxy Die Bonder Copper Clip

Features

Optional Up-look track for higher precision.
Optional DAF heating.
Dual dispensing & dual cameras independent,
epoxy writing, supports shower head mode.
Can pair with JAF-800 for clip products.
CCD independent visual system, high pixel count
and precise processing mode.
IQC function for real-time compensation.

Specification

Applications	Package: SOP, SSOP, TSOP, LQFP, TSSOP, SOT, QFN, PDFN, LFPAK, SOD, SMA, SMB, SMC, TOLL, TO, IPM series.
Die placement	Standard XY: ±25μm @3σ Theta: Die size ≥ 2 × 2 mm ±1° @3σ Die size < 2 × 2 mm ±2° @3σ Uplook XY: ±15μm @3σ Theta: ±1° @3σ
UPH	>12K for epoxy bonding (8+ rows lead frame)
Wafer Size	6″, 8″, 12″
Die Size	Die size: 0.25 × 0.25mm ~ 10 × 10mm; Thickness ≥0.06mm
Lead frame size	Lead frame: L:140 ~ 300mm W:30 ~ 102mm (below 30mm change rail) Thickness: 0.1 ~ 1.0mm
Bond force	50~350gf (programmable)
Bond head	Bond Head Rotation: ±180°, height measurement uses Encoder feedback
Visual	Pre-Bond / Post-Bond / Post-Epoxy
Dimensions	1400mm × 1400mm × 1600mm (Combine lead frame loading +500mm, unloading module +350mm)
Weight	1800Kg
Software	1. Windows with friendly operation interface, operation permission control. 2. Wafer Mapping function, and consumable-life management functions. 3. Real time working process display, Log information is saved in real time. 4. It supports standard SECS/GEM protocols.

JAF-800

Copper Clip Bonding System

Features

Up-look flying inspection for clip pickup status.
Dual or quad dispensing, independent stations compatible with show head mode.
Clip reel feeding, quick change cutting tool module.
CCD independent visual system, high pixel count
and precise processing mode.
Support magazine unloading or oven in-line.
IQC function for real-time compensation.

Specification

Applications	Package: PQFN, DFN, LFPAK, SOD, SMA, SMB, SMC, TOLL, TO series etc.
Placement	Before: ±50μm, ±3° @3σ After: ±100μm, ±5° @3σ
UPH	Dual-dispense: >10K (8+ rows lead frame) 4-dispense: >14K (8+ rows lead frame)
Dispensing accuracy	The single dot dispensing diameter uniformity is ±15%, single dot dispensing ±50μm @3σ (Glue properties)
Clip min-cutting size	Clip >0.7mm, Clip thickness 0.1–0.4mm
Lead Frame	L: 140–300mm W: 30–100mm T: 0.1–1mm
Bond force	300–1000gf, 1000–3000gf
Bond head	Bond Head Rotation: 180°
Singulation tool	Dimension (Width): ±0.05mm Vertical Burr <0.025mm Horizontal Burr <0.04mm
Visual	Pre-Bond / Post-Bond / Post-Epoxy
Dimensions	1500mm × 1200mm × 1600mm (additional unloading mechanism +350mm)
Weight	1800Kg
Software	1. Windows with friendly operation interface, operation permission control. 2. Consumable life management functions. 3. Real-time working process display. Log information is saved in real time. 4. It supports standard SECS/GEM protocols.

JAF-750

High-speed IC Die Bonder

Features

Dual dispensing module, supports “multiple-point”
dispensing and “writing” dispensing functions.
Linear motor control in the bonding module.
DOWN SET function, controlled by software parameters.
IQC with real-time feedback (PBI).
Intelligent epoxy detection and pressure compensation.
Auto Wafer Loader optional.
Combine loading method,suction/magazine.

Specification

Applications	DIP, SOP, SSOP, SIP, TSOP, PQFP, LQFP, TSSOP, SOT, QFN, DFN, QFP etc.
Die placement	X/Y: ±20μm @3σ Die size: >2×2mm ±1° @3σ Die size: <2×2mm ±2° @3σ
UPH	>16K (8+ rows lead frame)
Wafer size	6″, 8″, 12″
Die Size	Die size: 0.25×0.25mm–15×15mm; Die thickness ≥0.05mm;
Lead frame size	L:120–300mm W:30–100mm T:0.1–1.0mm
Bond force	50–350gf programmable (Max 1000gf optional)
Bond head	Bond Head Rotation: ±180°, height measurement uses Encoder feedback
DAF function	Single-stage heating; Max temperature: 200±5°
Visual	Pre-Epoxy/Bond Post-Epoxy/Bond; Bridging Check / Epoxy Coverage Check
Function	1. Four levels of operation permissions; each level can be set independently. 2. The equipment supports L/F Mapping and Wafer Mapping functions. 3. It supports standard SECS/GEM protocols and has Strip map and CIM parameter control functions.
Dimensions	L: 2280mm W: 1430mm H: 1600mm

JAF-760

High-precision IC Die Bonder

Features

Support dispensing dot and writing and DAF function.
Linear motor in main module (Dispensing and bonding).
DOWN SET function, software parameters control.
IQC with real-time PBI feedback.
Epoxy paste detection and automatic compensation.
Auto Wafer Loader.

Specification

Applications	SOT, SOP, SOIC, DFN, QFN, LQFP, PDFN, MEMS, LGA, etc.
Die placement	Standard X/Y: ±20μm @3σ Theta: ±2° @3σ UP LOOK X/Y: ±15μm @3σ Theta: ±1° @3σ
UPH	>13.5K (8+ rows lead frame)
Wafer size	6″, 8″, 12″
Die Size	Die: 0.25×0.25mm–15×15mm; Die thickness ≥0.05mm;
Lead frame size	Lead frame: L:120–300mm W:30–100mm T:0.1–1.0mm
Bond force	30–350gf programmable (Max 2500gf optional)
Bond head	Bond Head Rotation: ±180°, height measurement uses Encoder feedback
DAF function	Three-stage heating; Max temperature: 200±5°
Visual	Pre-Epoxy/Bond Post-Epoxy/Bond; Bridging Check / Epoxy Coverage Check
Function	1. Four levels of operation permissions; each level can be set independently. 2. Support L/F Mapping, Wafer Mapping function, standard SECS/GEM protocols. 3. Support and has Strip map and CIM parameter control functions.
Dimensions	L: 2280mm W: 1430mm H: 1600mm

JAF-800FC

Flip Chip Bonder

Features

High-speed, high-precision flip chip process.
Compatible with dipping adhesive and solder paste.
Supports Lead frame, Boat, Tape Reel etc.
Support Magazine, Stack Loader.

Specification

Die Placement	XY ±10μm @3σ Theta <1mm ±1° @3σ ≥1mm <5mm ±0.3° @3σ ≥5mm <10mm ±0.15° @3σ
UPH	>5.5K, MAX: 6.5K
Material – Wafer	Wafer size: 8″, 12″ Die size: 0.4mm × 0.4mm ~ 10mm × 10mm Die thickness: 0.1mm ~ 3mm
Material – Substrate	Length: 110mm ~ 300mm Width: 30mm ~ 130mm Thickness: 0.1mm ~ 5mm Support LeadFrame Support jig carrier
Material – Magazine	Length: 120mm ~ 310mm Width: 35mm ~ 140mm Height: 70mm ~ 153mm
Bond force	30~3000gf (programmable); 30~100gf: precision ±5g; 100~300gf: precision ±5%; 300~3000gf: precision ±10%
Bond head	Bond Head Rotation: ±180°, height measurement uses Encoder feedback
Visual	Pre-Bond / Pre Pick, Post-Bond, Down Look, Uplook
Software	Windows OS, graphical human-computer interaction interface, simple and user-friendly. Supports standard SECS/GEM protocols, extends Substrate/Strip/Wafer Mapping E142 functions. Supports Pseudo X-Ray, post-operation accuracy detection and other functions.

JAF-8000FC

High-precision Substrate Flip Chip Bonder

Features

High-speed and high-precision flip-chip process.
Dipping function.
Material: LeadFrame, Boat, etc.
Dual bonding system.

Specification

Die Placement	XY ±5μm @3σ Theta <1mm ±0.5° @3σ ≥1mm <5mm ±0.1° @3σ ≥5mm <10mm ±0.05° @3σ ≥10mm <30mm ±0.02° @3σ
UPH	MAX: 8K
Material – Wafer	Wafer size: 8″, 12″ Die size: 0.5mm × 0.5mm ~ 30mm × 30mm Die thickness: 0.08mm ~ 3mm
Material – Substrate	L: 100–300mm W: 30–200mm Thickness: 0.1–3mm
Dipping	Max 30mm × 30mm, depth customized
Bond force	30–3000gf (programmable); 30–200gf: precision ±10g; 200–3000gf: precision ±5%
Bond head	Bond Head Rotation: ±180°, height measurement uses Encoder feedback
Visual	Pre-Bond / Pre Pick, Post-Bond, Uplook
Software	Windows OS, graphical human-computer interaction interface, simple and user-friendly. Supports standard SECS/GEM protocols, extends Substrate/Strip/Wafer Mapping E142 functions. Supports Pseudo X-Ray, Post-bond precision detection.

JAF-8000FO

High-precision Wafer-level Die Bonder(Fan-out)

Features

High-speed and high-precision fan-out bonding technology.
Supports dipping and DAF process.
Compatible Face-up, Face-down.
Dual bonding system.

Specification

Die Placement	XY ±5μm @3σ regional, 8μm @3σ global Theta <1mm ±0.5° @3σ ≥1mm <5mm ±0.1° @3σ ≥5mm <10mm ±0.05° @3σ ≥10mm <30mm ±0.02° @3σ
UPH	MAX: 8K
Material – Wafer	Wafer size: 6″, 8″, 12″ Die size: 0.5mm × 0.5mm ~ 30mm × 30mm Die thickness: 0.08mm ~ 3mm
Material – Substrate	Compatible 8″ / 12″
C2W	12″ carrier (300mm / 330mm FO-WLP carrier)
Bond force	30~3000gf (programmable); 30~200gf: precision ±10gf; 200~3000gf: precision ±5%
Bond head	Bond Head Rotation: ±180°, height measurement uses Encoder feedback
Visual	Pre-Bond / Pre Pick, Post-Bond, Uplook
Software	Windows OS, graphical human-computer interaction interface, simple and user-friendly. Supports standard SECS/GEM protocols, extends Substrate/Strip/Wafer Mapping E142 functions. Supports Pseudo X-Ray, Post-bond precision detection.

JAF-DBC800

High-precision DBC Die Bonder

Features

Support 12″, 8″, 6″ wafers.
Support feeder, preform cutting, Tray, wafer feeding.
Nozzle and ejector auto change, flexibly adapting to different chip size.
Multi-material placement, flexible online programming.

Specification

Die placement	XY ±15μm @3σ Theta 0.1° @3σ
UPH	MAX: 3K
Materials – Wafer	Wafer size: 6″, 8″, 12″ Die size: 1mm × 1mm ~ 15mm × 15mm Die thickness: 0.08mm ~ 3mm
Materials – Substrate	465mm × 330mm
Materials – Waffle	4″, 2 sets most (optional)
Materials – Preform	2mm ~ 14mm, 3 sets most (optional)
Materials – Feeder	2 sets most (optional)
Bond force	30~300gf (programmable); Precision ±10g;
Bond head	6 bonding heads (Bond force control), 360° rotation
Visual	Pre-Bond / Pre Pick, Post-Bond, Uplook
Software	Windows OS, graphical human-computer interaction interface, simple and user-friendly. Supports standard SECS/GEM protocols, extends Substrate/Strip/Wafer Mapping E142 functions. Supports Pseudo X-Ray, post-operation accuracy detection and other functions.

JAF-D210

Dual-head Heavy Aluminum Wire Bonder

Features

Worktable position accuracy XY: ±5μm @3σ
Waveform management system for quality control.
Independent pull test function (100–500g range).
Stitch bond capability; loop height programmable (1–40mm).
Consumable change with automatic camera calibration.

Specification

Applications	Heavy aluminum wire
Diameter	100μm–500μm
Materials	Aluminum wire
Ultrasonic Frequency	110KHz
Placement Range	X: 130mm Y: 160mm
Lead frame size	100–300mm (L) × 15–65mm (W) × 2mm max. (T)
Operation system	Window8, Window10
Waveform Monitoring	Sink, current, voltage, phase, power, VCO
Dimensions	L: 1225mm W: 985mm H: 1630mm (Light tower excluded)

JAF-1000C2S^TCB

High-precision Substrate Thermo-compression Flip Chip Bonder

Features

Support 12″ wafer, compatible 6″ and 8″.
Chip to Substrate process.
Bond head electric leveling, pulse heating function.
Max Die Size 70mm × 70mm.
Double bond head.

Specification

Die Placement	XY ±2μm @3σ Theta 0.01° @3σ
UPH	MAX: 1K
Materials – Wafer	Wafer size: 8″, 12″ Die size: 1mm × 1mm ~ 70mm × 70mm Die thickness: 0.05mm ~ 3mm
Materials – Boat	Length: 310mm Width: 160mm Thickness: 1mm ~ 5mm
Materials – Substrate	Max: 120mm × 120mm
Bond force	3~300N (programmable)
Bonding platform	Constant temperature heating, Max: 200°C ±5°C
Bond head	Rotation: ±4° Electric leveling, coplanarity <2μm/10mm Pulse heating, 50~450°C, up to 150°C/s
Visual	Pre-Bond / Pre Pick, Post-Bond, Uplook
Software	Windows OS, graphical human-computer interaction interface, simple and user-friendly. Supports standard SECS/GEM protocols, extends Substrate/Strip/Wafer Mapping E142. Supports Pseudo X-Ray, Post-bond precision detection.