Highly specialized thermal processing systems designed to execute critical chemical and structural changes during wafer fabrication and advanced integrated circuit (IC) packaging.
Traditional package Application equipment, Advanced package Application equipment
Traditional package Application equipment, Advanced package Application equipment
Traditional package Application equipment, Advanced package Application equipment
Traditional package Application equipment, Advanced package Application equipment
For Advanced package underfill, DAF tape Application process, support AGV system
For Advanced package wafer and panel product, support OHT system Load Port + EFEM + Auto pressure oven
