Advanced packaging automation solution refers to a suite of highly dense manufacturing processes that integrate multiple chips (such as logic, compute, and memory) into a single, high-performance electronics package.
Automation
DBC Test Handler
UPH ≥ 180 pcs (HT)
UPH ≥ 300 pcs (RT)
Layout 4360 × 2420 mm
Auto load DBC and pre-heat;
Pick up DBC to high-temperature AC tester;
Pick up tested DBC to ambient DC tester;
Auto unload tested DBC.
AMB & Perform to Baseplate
UPH ≥ 120 pcs
Layout: 1980 * 1550 * 2000 mm
Pick up graphite fixture onto baseplate;
Pick up preform onto baseplate;
Pick up AMB onto preform;
Flow out by conveyor.
Frame Assembly Line
UPH ≥ 320 pcs (AMB)
Layout: 5140 * 1700 mm
Auto load and take out block onto conveyor;
Pick up AMB and place it to tray;
Dispense on AMB;
Pick up two types of preforms and place them onto AMB;
Pick up frame and assemble it onto AMB (with preforms);
Pick up block from conveyor and place it onto frame.
IGBT baseplate & frame assembly line
UPH > 80 pcs
Layout: 4000 * 3000 mm
Baseplate dispensing:
Positioning accuracy: ±0.05 mm, visual guidance.
Measure width/position of glue, tolerance: ±10% (Corner: ±20%).
Laser marking & plasma cleaning & auto load frame
QR code: min size: 3*3 mm
Auto assembly & screwing
Visual positioning, Robot auto assemble, accuracy: ±0.05 mm.
IGBT module high-temperature DC/AC test handler
UPH > 80 pcs
Layout: 6000 * 4000 mm
IGBT module pre-heating station.
IGBT module high-temperature AC/DC test station.
IGBT module cooling & sorting station.
IGBT ambient DC test handler
UPH > 80 pcs
Layout: 6000 * 4000 mm
ISO test: test electrical performance under 10KN pressure, double stations.
Ambient DC test: auto load/unload, DC test at room temperature.
Warpage inspection: Load/unload by Robot & flatness inspection run in parallel, to improve UPH.
